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SSM6K217FE Datasheet(PDF) 3 Page - Toshiba Semiconductor

Part # SSM6K217FE
Description  MOSFETs Silicon N-Channel MOS
PDF  9 Pages
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Manufacturer  TOSHIBA [Toshiba Semiconductor]
Direct Link  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

SSM6K217FE Datasheet(HTML) 3 Page - Toshiba Semiconductor

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SSM6K217FE
3
5.
5.
5.
5. Electrical Characteristics
Electrical Characteristics
Electrical Characteristics
Electrical Characteristics
5.1.
5.1.
5.1.
5.1. Static Characteristics (Unless otherwise specified, T
Static Characteristics (Unless otherwise specified, T
Static Characteristics (Unless otherwise specified, T
Static Characteristics (Unless otherwise specified, Taaaa = 25
= 25
= 25
= 25 
))))
Characteristics
Drain-source breakdown voltage
Drain-source breakdown voltage
Drain cut-off current
Gate leakage current
Gate threshold voltage
Drain-source on-resistance
Forward transfer admittance
(Note 1)
(Note 2)
(Note 2)
Symbol
V(BR)DSS
V(BR)DSX
IDSS
IGSS
Vth
RDS(ON)
|Yfs|
Test Condition
ID = 1 mA, VGS = 0 V
ID = 1 mA, VGS = -12 V
VDS = 40 V, VGS = 0 V
VDS = 0 V, VGS = ±10 V
VDS = 3 V, ID = 1 mA
ID = 1.0 A, VGS = 8.0 V
ID = 1.0 A, VGS = 4.5 V
ID = 1.0 A, VGS = 4.2 V
ID = 1.0 A, VGS = 3.6 V
ID = 0.5 A, VGS = 2.5 V
ID = 0.2 A, VGS = 1.8 V
VDS = 3 V, ID = 0.2 A
Min
40
25
0.5
Typ.
155
165
166
170
190
230
2
Max
1
±10
1.2
195
208
211
218
248
400
Unit
V
µA
V
mΩ
S
Note 1: Let Vth be the voltage applied between gate and source that causes the drain current (ID) to below (1 mA for
this device). Then, for normal switching operation, VGS(ON) must be higher than Vth, and VGS(OFF) must be
lower than Vth. This relationship can be expressed as: VGS(OFF) < Vth < VGS(ON).
Take this into consideration when using the device.
Note 2: Pulse measurement.
5.2.
5.2.
5.2.
5.2. Dynamic Characteristics (Unless otherwise specified, T
Dynamic Characteristics (Unless otherwise specified, T
Dynamic Characteristics (Unless otherwise specified, T
Dynamic Characteristics (Unless otherwise specified, Taaaa = 25
= 25
= 25
= 25 
))))
Characteristics
Input capacitance
Reverse transfer capacitance
Output capacitance
Switching time (turn-on time)
Switching time (turn-off time)
Symbol
Ciss
Crss
Coss
ton
toff
Test Condition
VDS = 10 V, VGS = 0 V,
f = 1 MHz
VDS = 10 V, ID = 0.5 A,
VGS = 0 to 2.5 V, RG = 4.7 Ω
Min
Typ.
130
7.5
26
13
8
Max
Unit
pF
ns
5.3.
5.3.
5.3.
5.3. Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
Fig.
Fig.
Fig.
Fig. 5.3.1
5.3.1
5.3.1
5.3.1 Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
Fig.
Fig.
Fig.
Fig. 5.3.2
5.3.2
5.3.2
5.3.2 Input Waveform/Output Waveform
Input Waveform/Output Waveform
Input Waveform/Output Waveform
Input Waveform/Output Waveform
5.4.
5.4.
5.4.
5.4. Gate Charge Characteristics (Unless otherwise specified, T
Gate Charge Characteristics (Unless otherwise specified, T
Gate Charge Characteristics (Unless otherwise specified, T
Gate Charge Characteristics (Unless otherwise specified, Taaaa = 25
= 25
= 25
= 25 
))))
Characteristics
Total gate charge (gate-source plus gate-drain)
Gate-source charge 1
Gate-drain charge
Symbol
Qg
Qgs1
Qgd
Test Condition
VDS = 10 V, ID = 1.8 A,
VGS = 4.2 V
Min
Typ.
1.1
0.18
0.5
Max
Unit
nC
2014-03-12
Rev.1.0



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