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T2SBA Series (SIP)
In order to avoid damaging devices, please observe the following precautions:
1.
When using automated soldering equipment, use 60/40 (Sn/Pb) solder (melting point of 180ºC) with a neutral flux
similar to rosin. Preheat time should be limited to 1 – 2 minutes at 150ºC.
2.
When using a soldering iron, use a tip temperature of less than 300ºC (or a soldering iron power of less than
60W). Keep the soldering time below 5 seconds.
3.
After soldering, remove any flux residue to avoid corrosion.
4.
Because over-voltage or over-current testing may cause permanent damage to the devices, be sure to check the
test equipment for proper voltage, current and ground connection prior to beginning the test.
5.
If the devices are to be encapsulated, they should be cleaned and dried at 120º ± 5ºC for at least 24 hours prior to
encapsulation. Test for compatibility between the device package and the encapsulation material.
Forward Voltage
0
1
2
3
4
5
6
7
8
9
10
0.4
0.6
0.8
1
1.2
VF (V)
TJ=150C
TJ=25C
P - Io Curve
0
0.5
1
1.5
2
2.5
3
3.5
0
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
2
Io (A)
Current Derating
Tc at PCB Pad (3 mm)
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
0
25
50
75
100
125
150
175
Tc (C)
Surge Forward Current
10
20
30
40
50
60
110
100
Cycles
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