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PM6685 Datasheet(PDF) 14 Page - STMicroelectronics |
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PM6685 Datasheet(HTML) 14 Page - STMicroelectronics |
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14 / 16 page ![]() 6 Package Mechanical Data PM6685 14/16 Table 7. VFQFPN 5x5x1.0 32L Pitch 0.50 1. – VFQFPN stands for Thermally Enhanced Very thin Fine pitch Quad Flat Package No lead. ___Very thin: A = 1.00mm Max. 2. – The leads size have been increased by Pb/Sn thickness in tin plating electrolytic process. 3. – Dimensions D & E do not include mold protusion, not to exceed 0,15mm. 4. – Package outline exclusive of metal burr dimensions. 5. – Dimensions D2 & E2 are not in accordance with JEDEC. Figure 4. Scheme Drawings Dim. Databook (mm.) Drawing (mm.) Min. Typ. Max Min. Typ. Max A 0.80 0.90 1.00 0.80 1.00 A1 0 0.02 0.05 0 0.05 A3 0.20 0.25 b 0.18 0.25 0.30 0.225 0.275 D(3) 4.85 5.00 5.15 4.90 5.00 5.10 D2(5) 3.65 3.95 3.65 3.95 E(3) 4.85 5.00 5.15 4.90 5.00 5.10 E2(5) 3.65 3.95 3.65 3.95 e 0.50 0.50 L 0.30 0.40 0.50 0.35 0.45 |
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