µPD4701A

13

RECOMMENDED SOLDERING CONDITIONS

The following conditions (see table below) must be met when soldering this product.

Please consult with our sales offices in case other soldering process is used, or in case soldering is done under

different conditions.

TYPES OF SURFACE MOUNT DEVICE

µPD4701AGT

Soldering process

Soldering conditions

Symbol

Infrared ray reflow

Peak package’s surface temperature: 235

°C or below,

IR35-00-2

Reflow time: 30 seconds or below (210

°C or higher),

Number of reflow process: 2, Exposure limit*: None

VPS

Peak package’s surface temperature: 215

°C or below,

VP15-00-2

Reflow time: 40 seconds or below (200

°C or higher),

Number of reflow process: 2, Exposure limit*: None

Wave soldering

Solder temperature: 260

°C or below,

WS60-00-1

Flow time: 10 seconds or below,

Number of flow process: 1, Exposure limit*: None

Partial heating method

Terminal temperature: 300

°C or below,

Flow time: 10 seconds or below,

Exposure limit*: None

* Exposure limit before soldering after dry-pack package is opened.

Storage conditions: 25

°C and relative humidity at 65 % or less.

Note Do not apply more than a single process at once, except for “Partial heating method”.

TYPE OF THROUGH HOLE MOUNT DEVICE

µPD4701AC

Soldering process

Soldering conditions

Symbol

Wave soldering

Solder temperature: 260

°C or below,

Flow time: 10 seconds or below