SUP .......................................................................-0.3V to +40V

BST to LX (Note 1)................................................................+6V

BST........................................................................-0.3V to +45V

OUT.......................................................................-0.3V to +18V

PGOOD ...................................................................-0.3V to +6V

PGND to AGND....................................................-0.3V to +0.3V

BIAS .....................................................................-0.3V to +6.0V

OUT Short-Circuit Duration ......................................Continuous

ESD Protection

Human Body Model ........................................................±2kV

12-pin TDFN/SW TDFN

(derate 24.4mW/°C above +70°C) ............................1951mW

Operating Junction Temperature (Note 5)........ -40°C to +150°C

Storage Temperature Range............................ -65°C to +150°C

Junction Temperature......................................................+150°C

Lead Temperature (Soldering, 10s).................................+300°C

Soldering Temperature (Reflow)......................................+260°C

MAX20075/MAX20076/

MAX25276

36V, 600mA/1.2A Mini Buck Converter

www.maximintegrated.com

Maxim Integrated │ 2

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a 4-layer board. For

detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

Note 1: LX has internal clamp diodes to PGND/AGND and SUP. Applications that forward bias these diodes should take care not to

exceed the IC’s package power-dissipation limits.

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Information

For the latest package outline information and land patterns (footprints), go to

www.maximintegrated.com/packages. Note that a “+”,

“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing

pertains to the package regardless of RoHS status.

Recommended Operating Conditions

PACKAGE TYPE: 12 TDFN-CU

Package Code

TD1233+2C

Outline Number

21-0664

Land Pattern Number

90-0397

PACKAGE TYPE: 12 SW TDFN

Package Code

TD1233Y+2C

Outline Number

21-100176

Land Pattern Number

90-100072

PACKAGE TYPE: 12 SW TDFN

Package Code

TD1233Y+3C

Outline Number

21-100284

Land Pattern Number

90-100072

THERMAL RESISTANCE, FOUR-LAYER BOARD

41°C/W

9°C/W

Parameter

Ambient temperature range

Conditions

-40°C to +125°C