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RABS2 Datasheet(PDF) 1 Page - Microdiode Semiconductor (Shenzhen) Co., Ltd |
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RABS2 Datasheet(HTML) 1 Page - Microdiode Semiconductor (Shenzhen) Co., Ltd |
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1 / 2 page ![]() GLASS PASSIVATED FAST RECOVERY BRIDGE RECTIFIERS DN:T19806A0 https://www.microdiode.com Rev:2019A0 Page :1 Voltage Range - 200 to 1000 V olts Current - 0.8/1.0 Ampere RABS2 THRU RABS10 Features Maximum Ratings And Electrical Characteristics Ratings at 25°C ambient temperature unle ss otherwise specified. Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%. Mechanical Data Ideal for printed circuit board Reliable low cost construction utilizing molded plastic technique High temperature soldering guaranteed: 260°/10 seconds at 5 lbs., (2.3kg) tension Small size, simple installation High surge current capability Glass passivated chip junction Case : JEDEC ABS Molded plastic body Terminals : Solder plated, solderable per MIL-STD-750,Method 2026 Polarity : Polarity symbol marking on body Mounting Position : Any Weight : 0.003 ounce, 0.098 grams ABS Dimensions in inches and (millimeters) Parameter SYMBOLS RABS2 RABS4 RABS6 RABS8 RABS10 UNITS Marking Code MDD RABS2 MDD RABS4 MDD RABS6 MDD RABS8 MDD RABS10 Maximum repetitive peak reverse voltage VRRM 200 400 600 80 0 1000 V Maximum RMS voltage VRMS 140 280 420 56 0 700 V Maximum DC blocking voltage VDC 200 400 600 80 0 1000 V Maximum average forward rectified current On glass-epoxy P.C.B.(Note1) On aluminum substrate(Note2) IF(AV) 0.8 1.0 A Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 30 A Maximum instantaneous forward voltage drop per leg at 0.4A VF 1.3 V Maximum DC reverse current TA=25°C at rated DC blocking voltage TA=100°C IR 5 500 uA uA Typicalthermalresistance RθJL RθJA 25 75 °C/W Maximum reverse recovery time trr 150 250 500 °C Operating temperature range TJ -55to+150 °C storage temperature range TSTG -55to+150 °C NOTES:1.On glass epoxy P.C.B. mounted on 0.05x0.05''(1.3x1.3mm) pads. 2.On aluminum substrate P.C.B. with an area of 0.8''x0.8''(20x20mm) mounted on 0.05X0.05''(1.3X1.3mm) solder pad. 3.Thermal resistance form junction to ambient and junction to lead mounted on P.C.B. with 0.2X0.2''(5X5mm) copper pads. 4.Reverse recovery condition IF=0.5A,IR=1.0A,Irr=0.25A. |
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