Pad Coordinates

Unit:

mm

Pad No.

X

Y

Pad No.

X

Y

1

-959.800

1271.550

18

959.450

-152.100

2

-959.800

1160.950

19

959.450

-41.500

3

-959.800

1060.950

20

959.450

58.500

4

-959.800

950.350

21

959.450

169.100

5

-959.800

850.350

22

959.450

269.100

6

-959.800

739.750

23

959.450

379.700

7

-959.800

639.750

24

959.450

479.700

8

-959.800

529.150

25

959.450

590.300

9

279.300

-1352.350

26

-46.550

1386.150

10

392.300

-1352.350

27

-157.150

1386.150

11

504.750

-1352.450

28

-257.150

1386.150

12

649.850

-1352.300

29

-367.750

1386.150

13

770.100

-1352.400

30

-467.750

1386.150

14

944.700

-1345.670

31

-578.350

1386.150

15

919.650

-1133.274

32

-678.350

1386.150

16

919.650

-1014.076

33

-788.950

1386.150

17

919.650

-336.224

Pad Description

Pad Name

I/O

Internal

Connection

Function

PA0~PA7

I/O

Pull-High

or None

Bidirectional 8-bit Input/Output port, wake-up by mask option

PB0~PB7

I/O

Pull-High

or None

Bidirectional 8-bit Input/Output port

PC0~PC7

I/O

Pull-High

or None

Bidirectional 8-bit Input/Output port

RCH, LCH

O

¾

Stereo audio output

OSC1

OSC2

I

O

¾

OSC1 and OSC2 are connected to an RC network or a crystal (by mask option)

for the internal system clock. In the case of RC operation, OSC2 is the output

terminal for 1/8 system clock. The system clock may come from the crystal, the

two pins cannot be floating.

VDDA

¾¾

DAC power supply

VDD

¾¾

Positive power supply

VSSA

¾¾

Negative power supply of DAC, ground

VSS

¾¾

Negative power supply, ground

RES

I

¾

Reset input, active low

Absolute Maximum Ratings

Storage Temperature ...........................

-50°Cto125°C

Operating Temperature ..........................

-25°Cto70°C

Note: These are stress ratings only. Stresses exceeding the range specified under

²Absolute Maximum Ratings² may

cause substantial damage to the device. Functional operation of this device at other conditions beyond those

listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-

ity.

HT36A1

Rev. 1.00

3

August 15, 2005