NXP Semiconductors

SOT753

plastic surface-mounted package; 5 leads

SOT753

All information provided in this document is subject to legal disclaimers.

Package information

8 February 2016

2 / 5

2. Package outline

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

SOT753

SC-74A

w

B

M

bp

D

e

A

A1

Lp

Q

detail X

HE

E

A

B

y

0

1

2 mm

scale

c

X

1

3

2

4

5

Plastic surface-mounted package; 5 leads

SOT753

UNIT

A1

bp

c

D

E

HE

Lp

Q

y

w

v

mm

0.100

0.013

0.40

0.25

3.1

2.7

0.26

0.10

1.7

1.3

e

0.95

3.0

2.5

0.2

0.1

0.2

DIMENSIONS (mm are the original dimensions)

0.6

0.2

0.33

0.23

A

1.1

0.9

02-04-16

06-03-16

Fig. 1. Package outline TSOP5 (SOT753)