21 / 23 page
Rev: 1.03 2/2000
21/23
© 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
D
GS820E32T/Q-150/138/133/117/100/66
TQFPand QFP Package Drawing
E1
E
b
e
c
L
L1
A2
A1
θ
Notes:
1. All dimensions are in millimeters (mm).
2. Package width and length do not include mold protrusion
TQFP
QFP
Symbol
Description
Min.
Nom.
Max
Min.
Nom.
Max
A1
Standoff
0.05
0.10
0.15
0.25
0.35
0.45
A2
Body Thickness
1.35
1.40
1.45
2.55
2.72
2.90
b
Lead Width
0.20
0.30
0.40
0.20
0.30
0.40
c
Lead Thickness
0.09
0.20
0.10
0.15
0.20
D
Terminal Dimension
21.9
22.0
22.1
22.95
23.2
23.45
D1
Package Body
19.9
20.0
20.1
19.9
20.0
20.1
E
Terminal Dimension
15.9
16.0
16.1
17.0
17.2
17.4
E1
Package Body
13.9
14.0
14.1
13.9
14.0
14.1
e
Lead Pitch
0.65
0.65
L
Foot Length
0.45
0.60
0.75
.60
0.80
1.00
L1
Lead Length
1.00
1.60
Y
Coplanarity
0.10
0.10
θ
Lead Angle
0
°
7
°
0
°
7
°
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