SP0504BBC, SP0508BBC, SP0516BBC

Silicon Protection Circuits

TVS Avalanche Diode Array in a Bipolar Chip Scale Package

203

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5

PARAMETER

Reverse Standoff Voltage

Reverse Standoff Leakage Current

Signal Clamp Voltage

Positive

Negative

Clamp Voltage during ESD

MIL-STD-883D Method 3015

ESD Test Level

IEC-61000-4-2, Contact discharge

MIL-STD-883D Method 3015 (HBM)

Capacitance

Turn on/off Time

Temperature Range

Operating

Storage

TEST CONDITIONS

I = 10µA

V = tbd V

I = 10mA

I = 10mA

8 kV Positive

8 kV Negative

2.5VDC @ 1Mhz

MIN

± 5.9

6.0

- 9.2

18

30

- 40

- 65

MAX

-

10

9.2

- 6.0

85

150

UNITS

V

µA

V

V

V

V

kV

kV

pF

ns

°C

°C

TYPICAL

-

7.6

- 7.6

14

-14

39

<1

Pad Size on PCB

Pad Shape

Pad Definition

Solder Mask Opening

Solder Stencil Thickness

Solder Stencil Aperature Opening

Solder Flux Ratio

Solder Paste

Board Trace Finish

0.300mm

Round

Non-Solder Mask

Defined Pads

(NSMD)

0.350mm

0.152mm

0.360mm (sq)

50/50

No Clean

OSP (Entek Cu Plus

106A)

PRINTED CIRCUIT BOARD RECOMMENDATIONS

0

48

97

Time (s)

145

194

242

290

339

387

435

EXH

CD

RF

Z

Z4

Z3

Z2

PH

EXH

250

225

200

175

150

125

100

75

50

25

Typical Solder Reflow Thermal Profile (No Clean Flux)

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