PRELIMINARY

FMA219

X-BAND LNA MMIC

Phone: +1 408 850-5790

http://www.filtronic.co.uk/semis

Revised: 11/22/04

Fax: +1 408 850-5766

Email: sales@filcsi.com

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Parameter

Symbol

Test Conditions

Min

Max

Units

Supply Voltage

For any operating current

6

V

Supply Current

100

mA

RF Input Power

For standard bias conditions

-5

dBm

Storage Temperature

Non-Operating Storage

-40

150

ºC

Total Power Dissipation

See De-Rating Note below

600

mW

Gain Compression

Comp.

Under any bias conditions

5

dB

2 or more Max. Limits

80

%

Notes:

•

Operating conditions that exceed the Absolute Maximum Ratings will result in permanent damage to the device.

•

•

Total Power Dissipation to be de-rated as follows above 22

°C:

(coefficient of de-rating formula is the Thermal Conductivity)

Example: For a 55

•

For optimum heatsinking eutectic die attach is recommended; conductive epoxy die attach is acceptable with

•

Note on Thermal Resistivity: The nominal value of 250

°C/W is stated for the input stage, which will reach

temperature limits before the output stage. The aggregate MMIC thermal resistivity is approximately 175

°C/W.

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HANDLING PRECAUTIONS

To avoid damage to the devices care should be exercised during handling. Proper Electrostatic

Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and

testing. These devices should be treated as Class 1A per ESD-STM5.1-1998, Human Body Model.

Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263.

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APPLICATIONS NOTES & DESIGN DATA

Applications Notes are available from your local Filtronic Sales Representative or directly from the

factory.