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TLV9352

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SBOS994A – NOVEMBER 2019 – REVISED MARCH 2020

Product Folder Links: TLV9352

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

This package option is preview for TLV9352.

6.5 Thermal Information for Dual Channel

TLV9352

UNIT

(SOIC)

(SOT-23-8)

(VSSOP)

(TSSOP)

8 PINS

8 PINS

8 PINS

8 PINS

Junction-to-ambient thermal

resistance

138.7

TBD

TBD

TBD

°C/W

Junction-to-case (top) thermal

resistance

78.7

TBD

TBD

TBD

°C/W

Junction-to-board thermal resistance

82.2

TBD

TBD

TBD

°C/W

Junction-to-top characterization

parameter

27.8

TBD

TBD

TBD

°C/W

Junction-to-board characterization

parameter

81.4

TBD

TBD

TBD

°C/W

Junction-to-case (bottom) thermal

resistance

N/A

TBD

TBD

TBD

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

This package option is preview for TLV9354.

6.6 Thermal Information for Quad Channel

TLV9354

UNIT

(SOIC)

(TSSOP)

14 PINS

14 PINS

Junction-to-ambient thermal resistance

TBD

TBD

°C/W

Junction-to-case (top) thermal resistance

TBD

TBD

°C/W

Junction-to-board thermal resistance

TBD

TBD

°C/W

Junction-to-top characterization parameter

TBD

TBD

°C/W

Junction-to-board characterization parameter

TBD

TBD

°C/W

Junction-to-case (bottom) thermal resistance

TBD

TBD

°C/W