TS29101CS05 datasheet(7/8 Pages) TSC

7 / 8 page

TS29100/1/2

7-7

2003/12 rev. A

Application Information (continues)

Power SOP-8 Thermal Characteristics

TS29101/2 series’ performance is its power SOP-8

package featuring half the thermal resistance of a

standard SOP-8 package. Lower thermal resistance

means more output current or higher input voltage for

a given package size.

Lower thermal resistance is achieved by connect the

four ground pins with the die attached pad to create a

single piece electrical and thermal conductor. This

concept have been used by MOSFET production for

years, proving very reliable and cost effective for the

user. As under:

Thermal resistance consists of two main elements, Θjc

(junction to case) and Θca (case to ambient). Using the

power SOP-8 reduces Θca, the total thermal

resistance, Θja (junction to ambient) is the limiting

factor in calculating the maximum power dissipation

capability of the device. Typically, the power SOP-8

have a Θjc of 20

oC/W dramatically , this is significantly

lower than the standard SOP-8 which is typically

oC/W. Θca is reduced because pin 5~8 can be

soldered directly to a ground plane which significantly

reduces the case to sink and sink to ambient thermal

resistance.

Power Dissipation

From under curves, the minimum area of copper

necessary for the par to operate safely can be

determined. The maximum allowable temperature rise

must be calculated to determine operation along which

curve.

TS29101CS05 Datasheet(PDF) 7 Page - Taiwan Semiconductor Company, Ltd