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IMXRT1060CEC Datasheet(PDF) 7 Page - NXP Semiconductors |
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IMXRT1060CEC Datasheet(HTML) 7 Page - NXP Semiconductors |
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7 / 111 page ![]() i.MX RT1060 Introduction i.MX RT1060 Crossover Processors for Consumer Products, Rev. 0.2, 02/2020 NXP Semiconductors 7 Figure 1 describes the part number nomenclature so that characteristics of a specific part number can be identified (for example, cores, frequency, temperature grade, fuse options, and silicon revision). The primary characteristic which describes which data sheet applies to a specific part is the temperature grade (junction) field. MIMXRT1062DVL6A • 600 MHz, commercial grade for general purpose, with MPU/FPU •eDMA • Boot ROM (128 KB) • On-chip RAM (1 MB) • SEMC •GPT x2 • 4-channel PIT • Qtimer x4 •PWM x4 •ENC x4 • WDOG x4 • LCD/CSI/PXP • SPDIF x1 • SAI x3 • MQS x1 • USB OTG x2 • eMMC 4.5/SD 3.0 x2 • Ethernet x2 •UART x8 •I2C x4 • FlexSPI x2 •CAN x2 • FlexCAN (with Flexible Data-Rate supported) • FlexIO x3 • 127 GPIOs (124 tightly coupled) • HAB/DCP/BEE • TRNG •SNVS •SJC • ADC x2 •ACMP x4 •TSC •DCDC • Temperature sensor • GPC hardware power management controller 10 x 10 mm, 0.65 mm pitch, 196-pin MAPBGA 0 to +95 MIMXRT1062DVJ6A • 600 MHz, commercial grade for general purpose, with MPU/FPU •eDMA • Boot ROM (128 KB) • On-chip RAM (1 MB) • SEMC •GPT x2 • 4-channel PIT • Qtimer x4 •PWM x4 •ENC x4 • WDOG x4 • LCD/CSI/PXP • SPDIF x1 • SAI x3 • MQS x1 • USB OTG x2 • eMMC 4.5/SD 3.0 x2 • Ethernet x2 •UART x8 •I2C x4 • FlexSPI x2 •CAN x2 • FlexCAN (with Flexible Data-Rate supported) • FlexIO x3 • 127 GPIOs (124 tightly coupled) • HAB/DCP/BEE • TRNG •SNVS •SJC • ADC x2 •ACMP x4 •TSC •DCDC • Temperature sensor • GPC hardware power management controller 12 x 12 mm, 0.8 mm pitch, 196-pin MAPBGA 0 to +95 Table 1. Ordering information Part Number Features Package Junction Temperature Tj (C) |
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