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MIC2007 Datasheet(PDF) 12 Page - Micrel Semiconductor

Part # MIC2007
Description  Adjustable Current Limit Power Distribution Switch
PDF  17 Pages
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Manufacturer  MICREL [Micrel Semiconductor]
Direct Link  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

MIC2007 Datasheet(HTML) 12 Page - Micrel Semiconductor

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Micrel
MIC2007/MIC2017
October 2005
12
M9999-102805
Enable
ENABLE is a HIGH true control signal, which activates
the main MOSFET switch. ENABLE will operate with
logic running from supply voltages as low as 1.8V, once
VIN has exceeded the UVLO threshold. ENABLE can be
wire-OR’d with other MIC2007/2017s or similar devices
without damage to the device.
ENABLE may be driven higher than VIN, but no higher
than 5.5V.
Slew Rate Control
Large capacitive loads can create significant current
surges when charged through a high-side switch such
as
the
MIC2007/2017.
For
this
reason,
the
MIC2007/2017 provides built-in slew rate control to limit
the initial inrush currents upon enabling the power
MOSFET switch.
Slew rate control is active upon powering up, and upon
re-enabling the load. At shutdown, the discharge slew
rate is controlled by the external load and output
capacitor.
On MIC2007/2017 slew rate is adjustable and can be
further reduced by adding an external capacitance
between VIN and the CSLEW pins.
Thermal Shutdown
Thermal
shutdown
is
employed to
protect
the
MIC2007/2017 from damage should the die temperature
exceed safe operating levels. Thermal shutdown shuts
off the output MOSFET if the die temperature reaches
145°C.
The MIC2007/2017 will automatically resume operation
when the die temperature cools down to 135°C. If
resumed operation results in reheating of the die, then
another
shutdown
cycle
will
occur
and
the
MIC2007/2017 will continue cycling between ON and
OFF states until the offending load has been removed.
Depending upon PCB layout, package type, ambient
temperature, etc., hundreds of milliseconds may elapse
from the incidence of a fault to the output MOSFET
being shut off. This delay is due to thermal time
constants within the system itself. In no event will the
device be damaged due to thermal overload because
die temperature is monitored continuously by on-chip
circuitry.



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