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VSC7440 Datasheet(PDF) 393 Page - Microsemi Corporation

Part # VSC7440
Description  L2/L3 Enterprise Gigabit Ethernet Switch with 10 Gbps Links
PDF  444 Pages
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Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

VSC7440 Datasheet(HTML) 393 Page - Microsemi Corporation

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Electrical Specifications
VMDS-10492 VSC7440 Datasheet Revision 4.2
376
6.1.8
Thermal Diode
The device includes an on-die diode and internal circuitry for monitoring die temperature (junction
temperature). The operation and accuracy of the diode is not guaranteed and should only be used as a
reference.
The on-die thermal diode requires an external thermal sensor, located on the board or in a stand-alone
measurement kit. Temperature measurement using a thermal diode is very sensitive to noise. The
following illustration shows a generic application design.
Figure 133 •
Thermal Diode
Note: Microsemi does not support or recommend operation of the thermal diode under reverse bias.
The following table provides the diode parameter and interface specifications with the pins connected
internally to VSS in the device.
The ideality factor, n, represents the deviation from ideal diode behavior as exemplified by the following
diode equation:
Output low voltage
VOL
0.4
V
IOL =2mA
Output low voltage
VOL
0.7
V
IOL =12mA
Input high voltage
VIH
1.85
3.6
V
Input low voltage
VIL
–0.3
0.8
V
Input high current2
IIH
10
µA
VI =VDD_IO
Input low current2
IIL
–100
µA
VI =0V
Input capacitance
CI
10
pF
1.
VDD_IO = 2.38 V minimum, VDD_IO = 2.5 typical.
2.
Input high current and input low current equals the maximum leakage current, excluding the current in the
built-in pull resistors.
Table 287 •
Thermal Diode Parameters
Parameter
Symbol
Typical
Maximum
Unit
Forward bias current
IFW
See note1
1.
Typical value is device dependent.
1mA
Diode ideality factor
n
1.008
Table 286 •
GPIO, SI, JTAG, and Miscellaneous Signals DC Specifications (continued)
Parameter
Symbol Minimum
Typical
Maximum
Unit
Condition
Microsemi
Die Cell
Temperature
Diode
External
Device
2200 pF
Anode
Cathode
Anode
Cathode
Isolated Sensor Circuit
D+
D–
Microsemi
Die Cell
Temperature
Diode
External
Device
2200 pF
Grounded Sensor Circuit
DXP
GND
IFW
IS e
qVD
() nkT
()
⁄
1
–
()
=



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