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9NE90 Datasheet(PDF) 1 Page - Jiangsu Donghai Semiconductor Technology Co.,Ltd |
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9NE90 Datasheet(HTML) 1 Page - Jiangsu Donghai Semiconductor Technology Co.,Ltd |
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1 / 11 page ![]() ROUM Semiconductor Technology CO.,LTD. Rev. 1.0 www.roum.cn Page 1 of 11 9NE90 1 Description These N-channel Enhanced VDMOSFETs, is obtained by the self-aligned planar technology which reduce the conduction loss, improve switching performance and enhance the avalanche energy. Which accords with the RoHS standard. 2 Features ● Fast Switching ● Low ON Resistance(Rdson≤1.3Ω) ● Low Gate Charge(Typical Data:62nC) ● Low Reverse Transfer Capacitances(Typical:18pF) ● 100% Single Pulse Avalanche Energy Test ● 100% Δ VDS Test 3 Applications ● used in various power switching circuit for system miniaturization and higher efficiency. ● Power switch circuit of adaptor and Charger. 9A 900V N-channel Enhancement Mode Power MOSFET 4 Electrical Characteristics 4.1 Absolute Maximum Rating(Tc=25℃,unless otherwise noted) PARAMETER SYMBOL VALUE UNIT Maximum Drian-Source DC Voltage VDS 900 V Maximum Gate-Drain Voltage VGS ±30 V Drain Current(continuous) ID(T=25℃) (T=100℃ ) 9 A 5.8 A Drain Current(Pulsed) (Note 1) IDM 36 A Single Pulse Avalanche Energy (Note 5) EAS 350 mJ Avalanche Energy Repetitive (Note 1) EAR 30 mJ Avalanche Current (Note 1) IAR 2.5 A Peak Diode Recovery dv/dt (Note 6) dv/dt 5 V/ns Total Dissipation Ta=25℃ Ptot 2 W TC=25℃ Ptot 137 W Gate-Source ESD (HBM- C=100pF,R=1.5KΩ) VESD(G-S) 3000 V Junction Temperature Tj 150 ℃ storage Temperature Tstg -55~150 ℃ Maximum Temperature for soldering TL 300 ℃ 4.2 Thermal Characteristics PARAMETER SYMBOL VALUE UNIT Thermal Resistance Junction to Case-sink RthJC 0.91 ℃/W Thermal Resistance Junction to Ambient RthJA 62.5 ℃/W VDSS = 900V RDS(on) (TYP)= 0.9Ω ID = 9A TO-220C |
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