Preliminary Datasheet

LP3352

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LP3352 Version 0.2 AUG-2018

Absolute Maximum Ratings

Note 1



VIN to GND --------------------------------------------------------------------------------------------------------

−0.3V to +27V



CH1~CH6, LX, OUT to GND ---------------------------------------------------------------------------------

−0.3V to +40V



EN, CTRL to GND -----------------------------------------------------------------------------------------------

−0.3V to +27V



VL, ISET to GND -------------------------------------------------------------------------------------------------

−0.3V to +7V



------------------------------------------------------

−40

℃ to +150℃



Operation Ambient Temperature Range

--------------------------------------------------------------

−40°C to +85°C



Storage Temperature Range

----------------------------------------------------------------------------

−65°C to +150°C



Maximum Soldering Temperature (at leads, 10sec)

----------------------------------------------- +260°C



Maximum Junction Temperature

----------------------------------------------------------------------- +150°C

Note 1.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress

ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of

the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Thermal Information



Thermal Resistance

QFN-16,

θ

JA

--------------------------------------------------------------------------------------------------- 88°C/W

QFN-16,

θ

JC

-------------------------------------------------------------------------------------------------- 39°C/W

Recommended Operating Conditions







