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4956F Datasheet(PDF) 8 Page - 3M Electronics

Part # 4956F
Description  Tapes provide the convenience and simplicity of a tape fastener and are ideal for use in many interior and exterior bonding applications. In many situations, they can replace rivets
PDF  9 Pages
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Manufacturer  3M [3M Electronics]
Direct Link  http://www.3m.com
Logo 3M - 3M Electronics

4956F Datasheet(HTML) 8 Page - 3M Electronics

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Application Techniques
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Clean: Most substrates are best prepared by cleaning with a 50:50 mixture of isopropyl alcohol (IPA*) and water prior to
applying 3M™ VHB™ Tapes.
Exceptions to the general procedure that may require additional surface preparation include:
Heavy Oils: A degreaser or solvent-based cleaner may be required to remove heavy oil or grease from a surface and
should be followed by cleaning with IPA/water.
Abrasion: Abrading a surface, followed by cleaning with IPA/water, can remove heavy dirt or oxidation and can
increase surface area to improve adhesion.
Adhesion Promoters: Priming a surface can significantly improve initial and ultimate adhesion to many materials
such as plastics and paints.
Porous surfaces: Most porous and fibered materials such as wood, particleboard, concrete, etc. need to be sealed
to provide a unified surface.
Unique Materials: Special surface preparation may be needed for glass and glass-like materials, copper and copper
containing metals, and plastics or rubber that contain components that migrate (e.g. plasticizers).
Refer to 3M Technical Bulletin “Surface Preparation for 3M™ VHB™ Tape Applications” for additional details and
suggestions. (70-0704-8701-5)
*Note: These cleaner solutions contain greater than 250 g/l of volatile organic compounds (VOC). Please consult your
local Air Quality Regulations to be sure the cleaner is compliant. When using solvents, be sure to follow the
manufacturer’s precautions and directions for use when handling such materials.
u
Pressure: Bond strength is dependent upon the amount of adhesive-to-surface contact developed. Firm application
pressure develops better adhesive contact and helps improve bond strength. Typically, good surface contact can be
attained by applying enough pressure to insure that the tape experiences approximately 15 psi (100 kPa) pressure. Either
roller or platen pressure can be used. Note that rigid surfaces may require 2 or 3 times that much pressure to make the
tape experience 15 psi.
u
Temperature: Ideal application temperature range is 70°F to 100°F (21°C to 38°C). Pressure sensitive adhesives use
viscous flow to achieve substrate contact area. Minimum suggested application temperatures:
• 50°F (10°C): 3M™ VHB™ Tapes 5952 and RP families.
• 60°F (15°C): 3M™ VHB™ Tape 4941 family.
Note: Initial tape application to surfaces at temperatures below these suggested minimums is not recommended
because the adhesive becomes too firm to adhere readily. However, once properly applied, low temperature
holding is generally satisfactory.
To obtain good performance with all 3M™ VHB™ Tapes, it is important to ensure that the surfaces are dry and free of condensed moisture.
u
Time: After application, the bond strength will increase as the adhesive flows onto
the surface (also referred to as “wet out”). At room temperature approximately
50% of ultimate bond strength will be achieved after 20 minutes, 90% after
24 hours and 100% after 72 hours. This flow is faster at higher temperatures
and slower at lower temperatures. Ultimate bond strength can be achieved more
quickly (and in some cases bond strength can be increased) by exposure of the
bond to elevated temperatures (e.g. 150°F [66°C] for 1 hour). This can provide
better adhesive wetout onto the substrates. Abrasion of the surfaces or the use of
primers/ adhesion promoters can also have the effect of increasing bond strength
and achieving ultimate bond strength more quickly.
100
80
60
40
20
0
20 MIN
1 HOUR
24 HOURS
72 HOURS
150°F or ABRADE
50°F
ROOM TEMP
PERCENT OF FULL BOND
Bond Typical Build vs. Time



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