ISO6741 datasheet(6/35 Pages) TI

6 / 35 page

6.4 Thermal Information

THERMAL METRIC(1)

ISO674x

UNIT

DW (SOIC)

16 PINS

RθJA

Junction-to-ambient thermal resistance

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

36.1

°C/W

RθJB

Junction-to-board thermal resistance

40.4

°C/W

ψJT

Junction-to-top characterization parameter

°C/W

ψJB

Junction-to-board characterization parameter

39.9

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Power Ratings

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

ISO6741

Maximum power dissipation (both sides)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15

pF, Input a 25-MHz 50% duty cycle

square wave

134.9

PD1

Maximum power dissipation (side-1)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15

pF, Input a 25-MHz 50% duty cycle

square wave

50.8

PD2

Maximum power dissipation (side-2)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15

pF, Input a 25-MHz 50% duty cycle

square wave

84.1

ISO6741

SLLSFJ6 – AUGUST 2020

www.ti.com

Submit Document Feedback

Product Folder Links: ISO6741

ISO6741 Datasheet(PDF) 6 Page - Texas Instruments

ISO6741 Datasheet(HTML) 6 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35

Datasheet Download

Link URL