STM32F722IC datasheet(6/229 Pages) STMICROELECTRONICS

6 / 229 page

Contents

STM32F722xx STM32F723xx

6/229

DS11853 Rev 6

6.3.31

Quad-SPI interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 197

6.3.32

SD/SDIO MMC card host interface (SDMMC) characteristics . . . . . . . 199

Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202

7.1

LQFP64 – 10 x 10 mm, low-profile quad flat package information . . . . . 202

7.2

LQFP100, 14 x 14 mm low-profile quad flat package information . . . . . 205

7.3

LQFP144, 20 x 20 mm low-profile quad flat package information . . . . . 208

7.4

LQFP176 24 x 24 mm low-profile quad flat package information . . . . . . .211

7.5

UFBGA144 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215

7.6

UFBGA176+25, 10 x 10, 0.65 mm ultra thin-pitch ball grid

array package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218

7.7

WLCSP100 - 0.4 mm pitch wafer level chip scale package information 221

7.8

Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225

Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226

Appendix A Recommendations when using internal reset OFF . . . . . . . . . . . 227

A.1

Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228

STM32F722IC Datasheet(PDF) 6 Page - STMicroelectronics