11.

Production Settings

11.1

Bake Information

The SAMA5D27-SOM1 module is rated MSL 3, indicating that storage and assembly processes must be compliant

with IPC/JEDEC J-STD-033C.

The SAMA5D27-SOM1 module has a total thickness of 2.750 mm (PCB and SMD mounted) and is comparable to a

die package. Thus baking instructions must comply with Table 4-1 of J-STD-033-C as a package body comprised

between 2.0mm and 4.5mm.

Refer to the highlighted information in the table below.

Table 4-1 Reference Conditions for Drying Mounted or Unmounted SMD

Packages (User Bake: Floor life begins counting at time=0 after bake)

Package Body

Level

Bake@ 125 °C +10/-0 °C

Bake@ 90 °C +8/-0 °C

≤5% RH

Bake@ 40 °C +5/-0 °C

≤5% RH

Exceeding

Floor Life

by >72 h

Exceeding

Floor Life

by ≤72 h

Exceeding

Floor Life

by >72 h

Exceeding

Floor Life

by ≤72 h

Exceeding

Floor Life

by >72 h

Exceeding

Floor Life

by ≤72 h

Thickness

≤1.4 mm

2

5 hours

3 hours

17 hours

11 hours

8 days

5 days

2a

7 hours

5 hours

23 hours

13 hours

9 days

7 days

3

9 hours

7 hours

33 hours

23 hours

13 days

9 days

4

11 hours

7 hours

37 hours

23 hours

15 days

9 days

5

12 hours

7 hours

41 hours

24 hours

17 days

10 days

5a

16 hours

10 hours

54 hours

24 hours

22 days

10 days

Thickness

>1.4 mm

≤2.0 mm

2

18 hours

15 hours

63 hours

2 days

25days

20 days

2a

21 hours

16 hours

3 days

2 days

29 days

22 days

3

27 hours

17 hours

4 days

2 days

37 days

23 days

4

34 hours

20 hours

5 days

3 days

47 days

28 days

5

40 hours

25 hours

6 days

4 days

57 days

35 days

5a

48 hours

40 hours

8 days

6 days

79 days

56 days

Thickness

>2.0 mm

≤4.5 mm

2

48 hours

48 hours

10 days

7 days

79 days

67 days

2a

48 hours

48 hours

10 days

7 days

79 days

67 days

3

48 hours

48 hours

10 days

8 days

79 days

67 days

4

48 hours

48 hours

10 days

10 days

79 days

67 days

5

48 hours

48 hours

10 days

10 days

79 days

67 days

5a

48 hours

48 hours

10 days

10 days

79 days

67 days

BGA package

>17 mmx 17 mm

or any stacked

die package

2-5a

96 hours

(See Note 2)

As above

per package

thickness and

moisture level

Not applicable

As above

per package

thickness and

moisture level

Not applicable

As above

per package

thickness and

moisture level

Note 1: Table 4-1 is based on worst-case molded lead frame SMD packages. Users may reduce the actual bake time if technically justified (e.g., absorption/

desorption data, etc.). In most cases it is applicable to other nonhermetic surface mount SMD packages. If parts have been exposed to >60% RH it

may be necessary to increase the bake time by tracking desorption data to ensure parts are dry.

Note 2: For BGA packages >17 mmx 17 mm, that do not have internal planes that block the moisture di usion path in the substrate, may use bake times

based on the thickness/moisture level portion of the table.

Note 3: If baking of packages >4.5 mm thick is required see appendix B.

IPC/JEDEC J-STD-033C

February 2012

11.2

Reflow Profile

The SAMA5D27 SOM1 was assembled using standard lead-free reflow profile IPC/JEDEC J-STD-020E. We

recommend a maximum of two soldering processes.

SAMA5D27 SOM1

Production Settings

Datasheet

DS60001521D-page 48