OPA300, OPA2300

OPA301, OPA2301

SBOS271B − MAY 2003 − REVISED JUNE 2005

www.ti.com

2

PRODUCT

PACKAGE-LEAD

PACKAGE DESIGNATOR

PACKAGE MARKING

OPA300

SO-8

D

300A

OPA300

SO-8

D

300A

OPA300

SOT23-6

DBV

A52

OPA300

SOT23-6

DBV

A52

OPA301

SO-8

D

301A

OPA301

SO-8

D

301A

OPA301

SOT23-5

DBV

AUP

OPA301

SOT23-5

DBV

AUP

OPA2300

MSOP−10

DGS

C01

OPA2301

SO−8

D

OPA2301A

OPA2301

MSOP−8

DGK

C02

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website

at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted(1)

Power Supply V+

7V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Signal Input Terminals(2), Voltage

0.5V to (V+) + 0.5V

. . . . . . . . . . .

Current

±10mA

. . . . . . . . . . . . . . . . . . . . .

Open Short-Circuit Current(3)

Continuous

. . . . . . . . . . . . . . . . . . . .

Operating Temperature Range

−55

°C to +125°C

. . . . . . . . . . . . . . .

Storage Temperature Range

−60

°C to +150°C

. . . . . . . . . . . . . . . . .

Junction Temperature

+150

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead Temperature (soldering, 10s)

+300

°C

. . . . . . . . . . . . . . . . . . . . .

ESD Ratings

Human Body Model (HBM)

4kV

. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Charged-Device Model (CDM)

500V

. . . . . . . . . . . . . . . . . . . . . . . .

(1) Stresses above these ratings may cause permanent damage.

Exposure to absolute maximum conditions for extended periods

may degrade device reliability. These are stress ratings only, and

functional operation of the device at these or any other conditions

beyond those specified is not implied.

(2) Input terminals are diode clamped to the power-supply rails. Input

signals that can swing more than 0.5V beyond the supply rails

should be current limited to 10mA or less.

(3) Short-circuit to ground; one amplifier per package.

ELECTROSTATIC DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas

Instruments recommends that all integrated circuits be

handled with appropriate precautions. Failure to observe

proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to

complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.

PIN ASSIGNMENTS

Top View

MSOP, SO, SOT

NOTE: (1) Not connected. (2) SOT23-6 pin 1 oriented as shown with reference to package marking.

1

2

3

4

8

7

6

5

Enable

V+

V

OUT

−In

+In

V

−

OPA300

SO−8

1

2

3

4

8

7

6

5

V+

V

OUT

−In

+In

V

−

OPA301

SO−8

1

2

3

5

4

V+

−In

Out

V

−

+In

OPA301

SOT23−5

1

2

3

6

5

4

V+

Enable

−In

Out

V

−

+In

OPA300

1

2

3

4

8

7

6

5

V+

Out B

−In B

+In B

Out A

−In A

+In A

V

−

A

B

OPA2301

SO−8, MSOP−8

1

2

3

4

5

10

9

8

7

6

V+

Out B

−In B

+In B

Enable B

Out A

−In A

+In A

V

−

Enable A

A

B

OPA2300

MSOP−10