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CEXPRESS-AL Datasheet(PDF) 1 Page - Adlink Technology Inc. |
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CEXPRESS-AL Datasheet(HTML) 1 Page - Adlink Technology Inc. |
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1 / 4 page ![]() cExpress-AL COM Express Compact Size Type 6 Module with Intel Atom® E3900 series and Pentium®/Celeron® SoC Features ● Intel Atom® E3900 series (formerly Apollo Lake) and Pentium®/Celeron® SOC, supporting full virtualization (VT-d/VT-x) ● Supports IEEE 1588 Precision Time Protocol (PTP) ● Up to 8GB dual channel non-ECC DDR3L at 1867/1600 MHz ● Two DDI channels, one LVDS (VGA/eDP by build option), supports up to 3 independent displays ● Up to Five PCIe x1 Gen2 (by PCIe bridge IC, build option) ● Two SATA 6 Gb/s, three USB 3.0/2.0, five USB 2.0 and eMMC 5.0 (build option) ● Extreme Rugged operating temperature: -40°C to +85°C (build option for E3900 series SKUs) Specifications ● Core System CPU Intel Atom® E3900 series (formerly Apollo Lake)/Pentium®/Celeron® SoC on 14nm process Atom® E3950 1.6/2.0GHz (Turbo), 12W (4C/1866) Atom® E3940 1.6/1.8GHz (Turbo), 9W (4C/1866) Atom® E3930 1.3/1.8GHz (Turbo), 6W (2C/1866) Pentium® N4200 1.1/2.5GHz (Turbo), 6W (4C/1866) Celeron® N3350 1.1/2.3GHz (Turbo), 6W (2C/1866) Note: Pentium®/Celeron® support by project basis Supports: Intel® VT, Intel® VT-d, Intel® TXT, Intel® SSE4.2, Intel® 64 Architecture, IA 32-bit, Intel® AES-NI, dual or quad Out-of-Order Execution (OOE) processor cores, PCLMULQDQ Instruction DRNG Notes: Availability of features may vary between processor SKUs. Pentium®/Celeron® supported by project basis. Memory Dual channel 1867/1600 MHz non-ECC DDR3L memory up to 8GB in dual SODIMM socket (maximum by 2pcs 4GB or 1pcs 8GB SO-DIMM) Embedded BIOS AMI EFI with CMOS backup in 16MB SPI BIOS (dual BIOS by build option) Expansion Busses 3 PCI Express x1 Gen2 (AB): Lanes 0/1/2 by default Note: 5 PCI Express x1 Gen2 (AB): Lanes 0/1/2/3/4 through PCIe bridge IC by request. LPC bus, SMBus (system) , I2C (user) SEMA Board Controller Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, failsafe BIOS (dual BIOS), watchdog timer and fan control Debug Headers 40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs MIPI60 header for ICE debug of CPU/chipset (build option) ● Audio Chipset Intel® HD Audio integrated in SoC Audio Codec On carrier Express-BASE6 (ALC886 standard support) ● Ethernet Intel® Ethernet Controller I210 (Extreme Rugged operating temperature range) Intel® Ethernet Controller I211 (standard operating temperature range) Supports IEEE 1588 and GbE0_SDP (I210 only) ● Video GPU Feature Support Intel® Gen9 LP Graphics Core, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS or eDP/VGA outputs Hardware encode/transcode (including HEVC) DirectX 12, DirectX 11.3, DirectX 10, DirectX 9.3 support OpenGL 4.3 and ES 3.0 support OpenCL 2.0 support Digital Display Interface DDI1/2 supporting DisplayPort/HDMI/DVI VGA Build option support through DP-to-VGA IC (in place of DDI2) LVDS Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC eDP 4 lanes support (build option, in place of LVDS) Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times. |
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