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CEXPRESS-SL Datasheet(PDF) 1 Page - Adlink Technology Inc. |
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CEXPRESS-SL Datasheet(HTML) 1 Page - Adlink Technology Inc. |
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1 / 4 page ![]() cExpress-SL COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ and Celeron® Processors Features ● 6th Generation Intel® Core™ and Celeron® Processors ● Up to 32GB Dual Channel non-ECC DDR4 at 1867/2133MHz ● Two DDI channels, one LVDS (build option 4 lanes eDP), supports up to 3 independent displays ● GbE, up to 6 PCIe x1 (build option) ● Up to three SATA 6 Gb/s, four USB 3.0 and four USB 2.0 ● Supports Smart Embedded Management Agent (SEMA®) functions ● Extreme Rugged operating temperature: -40°C to +85°C (build option) New Specifications ● Core System CPU 6th Generation Intel® Core™ and Celeron® Processors - Mobile 14nm process (formerly “Skylake-U”) Core™ i7-6600U 2.6/3.4GHz (Turbo), 4M, 15W (7.5W cTDP)(2C/GT2) Core™ i5-6300U 2.4/3.0GHz (Turbo), 3M, 15W (7.5W cTDP) (2C/GT2) Core™ i3-6100U 2.3GHz, 3M, 15W (7.5W cTDP) (2C/GT2) Celeron® 3955U 2GHz, 2M, 15W (10W cTDP) (2C/GT1) Supports: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX. Note: Availability of features may vary between processor SKUs. Memory Dual channel 1867/2133 MHz non-ECC DDR4 memory up to 32GB in dual SODIMM socket Embedded BIOS AMI EFI with CMOS backup in 8MB SPI BIOS with Intel® AMT 11.0 support (AMT support available on Core™ i7/i5 only) Cache 4MB for Core™ i7, 3MB for Core™ i5 and Core™ i3, 2MB for Celeron® Expansion Busses Up to 6 PCI Express x1 (AB): Lanes 0-5 (configurable to x2, x4, Lane 5 by build option) Note: Gen3 for Core™ i7/i5/i3, Gen2 for Celeron® LPC bus, SMBus (system) , I2C (user) SEMA Board Controller Supports : Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, failsafe BIOS (dual BIOS ), watchdog timer and fan control Debug Headers 40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs 60-pin XDP header for ICE debug of CPU/chipset ● Video GPU Feature Support Intel® Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS or eDP outputs Hardware encode/transcode HD content (including HEVC DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support OpenGL 5.0, 4.4/4.3 and ES 2.0 support OpenCL 2.1, 2.0/1.2 support Digital Display Interface DDI1/2 supporting DisplayPort/HDMI/DVI LVDS Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC eDP 4 lane support build option, in place of LVDS ● Audio Chipset Intel® HD Audio integrated in SOC Audio Codec On carrier Express-BASE6 (ALC886 standard support) ● Ethernet Interface: 10/100/1000 GbE connection ● I/O Interfaces USB: 4x USB 1.1/2.0/3.0 (USB 0,1,2,3) and 4x USB 1.1/2.0 (USB 4,5,6,7) SATA: Up to three ports SATA 6 Gb/s (SATA 0,1,2; Celeron® supports two ports only Serial: 2 UART ports with console redirection GPIO: 4 GPO and 4 GPI from BMC Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times. Intel® MAC/PHY: i219LM/V with AMT 11.0 support |
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