MIC2215 datasheet(4/22 Pages) MICROCHIP

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MIC2215

DS20006274A-page 4

 2019 Microchip Technology Inc.

Ripple Rejection

PSRR

—

VIN = VOUT + 1.0V; IOUT = 150 mA,

f = 0.1 kHz to 1 kHz, CBYP =

0.1 μF

—

VIN = VOUT + 0.4V; IOUT = 150 mA,

f = 0.1 kHz to 1 kHz, CBYP =

0.1 μF

—

VIN = VOUT + 0.2V; IOUT = 150 mA,

f = 0.1 kHz to 1 kHz, CBYP =

0.1 μF

Current Limit

ILIM

350

700

—

VOUT = 0V (All regulators)

Output Voltage Noise

—

μVRMS

CBYP = 0.1 μF, f = 10 Hz to

100 kHz

Turn-On Time

tON

—

100

μs

CBYP = 0.01 μF

Enable Input

Enable Input Voltage

VEN

—

0.4

Logic Low (Regulator shutdown)

1.5

—

Logic High (Regulator enabled)

Enable Input Current

IEN

—

1.0

—

μA

VIL < 0.4V (Regulator shutdown)

—

0.01

—

VIH > 1.5V (Regulator enabled)

TEMPERATURE SPECIFICATIONS

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Operating Junction Temperature

Range

–40

—

+125

°C

Note 1

Storage Temperature Range

–65

—

+150

°C

—

Lead Temperature

TLEAD

—

+260

°C

Soldering, 5 sec.

Package Thermal Resistance

Thermal Resistance, QFN 16-Ld

θJA

—

°C/W

—

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Characteristics: VIN1 = VIN2 = VIN3 = VOUT (highest nominal) +1.0V; COUT = 1.0 μF, IOUT = 100 μA; TJ =

+25°C, bold values indicate –40°C ≤ TJ ≤ +125°C unless noted. Note 1

Parameter

Sym.

Min.

Typ.

Max.

Units

Conditions

Note 1: Specification for packaged product only.

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