DF2005S thru DF210S

Pb Free Plating Product

DF2005S thru DF210S

2.0 AMPERE SINGLE PHASE GLASS PASSIVATION SURFACE MOUNT BRIDGE RECTIFIERS

Pb

© 1995 Thinki Semiconductor Co., Ltd.

http://www.thinkisemi.com.tw/

Page 1/2

Rev.10T

Features

• Glass passivation pellet(glass passivated chip junction)

• Low forward voltage drop

• High surge overload rating of 60 A peak

• Ideal for printed circuit board

Mechanical Data

• Case: Molded plastic, DB-S/DF-S

• Epoxy: UL 94V-0 rate flame retardant

• Terminals: Leads solderable per MIL-STD-202,

method 208 guaranteed

• Mounting position: Any

.045(1.14)

.335(8.51)

.009(0.25)

.205(5.2)

.195(5.0)

.035(0.89)

.316(8.05)

Unit : inch (mm)

DB-S/DF-S

PARAMETER

SYMBOL

UNIT DF2005S DF201S DF202S DF204S DF206S DF208S DF210S

ThinkiSemi device body marking code

Repetitive peak reverse voltage

V

RRM

V

50

100

200

400

600

800

1000

Average rectified output

current @

60Hz sine

wave, R-load, Ta=40℃

On glass-epoxi

substrate

IO

A

2

Surge(non-repetitive)forward current

@60H

IFSM

A

60

Current squared time

@1ms≤t<8.3ms Tj=25℃, Rating of per diode

I

A

15

Storage temperature

Tstg

℃

-55 ~+150

Junction temperature

Tj

℃

-55 ~+150

PARAMETER

SYMBOL UNIT

TEST

CONDITIONS

Maximum instantaneous forward

voltage drop per diode

VF

V

IFM=1A

1.05

Maximum DC reverse current at

rated DC blocking voltage per diode

IRRM

5

 

PARAMETER

SYMBOL UNIT

Thermal

Resistance

Between junction

and ambient,

On glass-epoxi

substrate

RθJ-A

℃

/W

68

Between junction

and lead

RθJ-L

15

Internal Configuration

DF2005S

DF201S

DF202S

DF204S

DF206S

DF208S

DF210S

DF2005S

DF201S

DF202S

DF204S

DF206S

DF208S

DF210S

DF2005S DF201S

DF202S

DF204S

DF206S

DF208S

DF210S