7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Input voltage

VIN

-0.3

20

V

Enable voltage

EN

-0.3

VIN + 0.3

V

Output voltage

-0.3

6

V

Output short circuit current

40

mA

Operating temperature range

-55

150

°C

Storage temperature range

-65

170

°C

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied. These are stress ratings only and functional operation of the device at these or any other conditions

beyond those specified in the Electrical Characteristics Table is not implied.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001,

all pins(1)

±TBD

V

Charged device model (CDM), per JEDEC specification

JESD22-C101, all pins(2)

±TBD

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

Input voltage

(1)

18

V

EN

Enable voltage

0

VIN

V

Output current

–10

10

mA

Operating temperature

–40

25

125

°C

(1)

Dropout voltage

7.4 Thermal Information

THERMAL METRIC(1)

DEVICE

UNIT

FKH (CERAMIC)

DGK (MSOP)

8 PINS

8 PINS

Junction-to-ambient thermal resistance

95.8

201.2

°C/W

Junction-to-case (top) thermal resistance

59.0

85.7

°C/W

Junction-to-board thermal resistance

58.3

122.9

°C/W

Junction-to-top characterization parameter

48.2

21.2

°C/W

Junction-to-board characterization parameter

58.1

121.4

°C/W

Junction-to-case (bottom) thermal resistance

28.5

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

REF70

SNAS781 – OCTOBER 2020

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