1 - 2

© 2000 IXYS All rights reserved

Symbol

Test Conditions

Characteristic Values

(T

Min.

Typ.

Max.

BV

CES

I

C

= 3 mA, V

1000

V

V

GE(th)

I

C

= 250

mA, V

2.5

5.0

V

I

CES

V

T

25

°C

250

mA

V

T

mA

I

GES

V

±100

nA

V

CE(sat)

I

C

= I

12N100

3.5

V

12N100A

4.0

V

IGBT

Preliminary Data Sheet

Symbol

Test Conditions

Maximum Ratings

V

CES

T

J

= 25

°C to 150°C

1000

V

V

CGR

T

J

= 25

°C to 150°C; R

1000

V

V

GES

Continuous

±20

V

V

GEM

Transient

±30

V

I

C25

T

C

= 25

°C24

A

I

C90

T

C

= 90

°C12

A

I

CM

T

C

= 25

°C, 1 ms

48

A

SSOA

V

I

A

(RBSOA)

Clamped inductive load, L = 300

mH

@ 0.8 V

CES

P

C

T

C

= 25

°C

100

W

T

J

-55 ... +150

°C

T

JM

150

°C

T

stg

-55 ... +150

°C

M

d

Mounting torque with screw M3

0.45/4 Nm/lb.in.

Mounting torque with screw M3.5

0.55/5 Nm/lb.in.

Weight

4g

Maximum lead temperature for soldering

300

°C

1.6 mm (0.062 in.) from case for 10 s

V

CES

I

C25

V

CE(sat)

IXGA/IXGP12N100

1000 V

24 A

3.5 V

24 A

4.0 V

95591A (3/97)

Features

• International standard packages

JEDEC TO-220AB and TO-263AA

process

• Low V

CE(sat)

- for minimum on-state conduction

losses

• MOS Gate turn-on

- drive simplicity

Applications

• AC motor speed control

• DC servo and robot drives

• DC choppers

• Uninterruptible power supplies (UPS)

• Switch-mode and resonant-mode

power supplies

Advantages

• Easy to mount with one screw

• Reduces assembly time and cost

• High power density

G

C

E

TO-220AB (IXGP)

G

E

TO-263 (IXGA)

C (TAB)

IXYS reserves the right to change limits, test conditions, and dimensions.