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LT3486 Datasheet(PDF) 18 Page - Analog Devices |
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LT3486 Datasheet(HTML) 18 Page - Analog Devices |
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18 / 26 page ![]() LT3756/LT3756-1/LT3756-2 18 Rev. C For more information www.analog.com APPLICATIONS INFORMATION Loop Compensation TheLT3756usesaninternaltransconductanceerrorampli- fier whose VC output compensates the control loop. The external inductor, output capacitor and the compensation resistor and capacitor determine the loop stability. The inductor and output capacitor are chosen based on performance, size and cost. The compensation resistor and capacitor at VC are selected to optimize control loop response and stability. For typical LED applications, a 2.2nF compensation capacitor at VC is adequate, and a series resistor should always be used to increase the slew rate on the VC pin to maintain tighter regulation of LED current during fast transients on the input supply to the converter. Board Layout The high speed operation of the LT3756 demands careful attention to board layout and component placement. The exposed pad of the package is the only GND terminal of the IC and is also important for thermal management of the IC. It is crucial to achieve a good electrical and thermal contact between the exposed pad and the ground plane of theboard.Toreduceelectromagneticinterference(EMI),it isimportanttominimizetheareaofthehighdV/dtswitching node between the inductor, switch drain and anode of the Schottky rectifier. Use a ground plane under the switching node to eliminate interplane coupling to sensitive signals. The lengths of the high dI/dt traces: 1) from the switch node through the switch and sense resistor to GND, and 2) from the switch node through the Schottky rectifier and filter capacitor to GND should be minimized. The ground points of these two switching current traces should come to a common point then connect to the ground plane under the LT3756. Likewise, the ground terminal of the bypass capacitor for the INTVCC regulator should be placed near the GND of the switching path. Typically, this requirement will result in the external switch being closest to the IC, along with the INTVCC bypass capacitor. The ground for the compensation network and other DC control signals should be star connected to the underside of the IC. Do not extensively route high impedance signals such as FB and VC, as they may pick up switching noise. In particular, avoid routing FB and PWMOUT in parallel for more than a fewmillimetersontheboard.Likewise,minimizeresistance in series with the SENSE input to avoid changes (most likely reduction) to the switch current limit threshold. |
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