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notch-filter_commercial_avrf_en.fm

EMC Components

AVRF series

Attention on a circuit board design

Board design

When attached to products, amount of silver used (fillet size) has

direct impact on products after mounting. Thus, sufficient consider-

ation is necessary.

Set of land dimensions

(1) As the stress rises in the products owing to the increase in sil-

ver, breakage and cracks will occur. Cause including crack, as cau-

tion on board land design, configure the shape and dimensions so

that the amount of silver is appropriate. If you installed 2 or more

parts in the Common Land, separated by a solder resist and spe-

cial land of each component.

(2) When peak levels panning-at soldering is excessive, by solder

contraction stress, mechanical-thermal stress causes a Yasuku

chip crack. In addition, when the peak level is underestimated, ter-

minal electrode fixed strength is insufficient. This causes chip

dropouts and may affect circuit reliability. Representative example

of the panning of peak levels is shown in the following.

Recommended silver dose

Case and suggested protocol want to avoid

Dimensions shape

Symbol

A

B

C

0603

0.25 to 0.35

0.20 to 0.30

0.25 to 0.35

1005

0.30 to 0.50

0.35 to 0.45

0.40 to 0.60

A

B

C

Solder volume

overload

Solder stress is increased,

and it is easy for a crack to

form.

Decent solder

volume

Solder volume

deficit

Fixed strength is weak, and

there is connection a prob-

lem and risk of loss.

Example

Cases to avoid

Improvement example

(land division)

Lead wire and land

of part discrete

doubles up

Arrangements in

the vicinity

Arrangements of

chip component's

companion

Most large serving amount

Minimum prime amount

Solder

Chip

Leads

PCB

Solder resist

Leads

Solder

(ground solder)

Chassis

L1

Solder resist

L2

L2>L1

Land

Land

Excess solder

Missing solder

Solder resist