Channel 4

(50 mA / div)

Channel 2

(200 mV / div)

Time (500 s / div)

m

Channel 2 = V

Channel 4 = I

V

= 4.3 V

OUT

OUT

IN

G027

Channel 2

(1 V / div)

Channel 1

(500 mV / div)

Time (50 s / div)

m

G032

Channel 1 = EN

2 = V

V

= 4.3 V

C

= 2.2 F

TPS70933

Channel

OUT

IN

OUT

m

TPS709

SBVS186G – MARCH 2012 – REVISED NOVEMBER 2015

www.ti.com

8.2.2 Detailed Design Procedure

Select a 2.2-µF, 10-V X7R output capacitor to satisfy the minimum output capacitance requirement with a 3.3-V

dc bias.

Select a 1.0-µF, 25-V X7R input capacitor to provide input noise filtering and eliminate high-frequency voltage

transients.

8.2.3 Application Curves

Figure 37. TPS70933 Load Transient (50 mA to 150 mA)

Figure 38. Power-Up with Enable

9 Power Supply Recommendations

This device is designed to operate with an input supply range of 2.7 V to 30 V. If the input supply is noisy,

additional input capacitors with low ESR can help improve output noise performance.

9.1 Power Dissipation

The ability to remove heat from the die is different for each package type, presenting different considerations in

the printed circuit board (PCB) layout. The PCB area around the device that is free of other components moves

the heat from the device to ambient air. Performance data for JEDEC low and high-K boards are given in the

Thermal Information table. Using heavier copper increases the effectiveness in removing heat from the device.

The addition of plated through-holes to heat-dissipating layers also improves the heatsink effectiveness.

of the output current and the voltage drop across the output pass element, as shown in Equation 1:

(1)

16

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