6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Single-supply

6

V

Dual-supply

±3

Input voltage, all pins

Common-mode

(V–) – 0.5

(V+) + 0.5

V

Differential

(V+) – (V–) + 0.2

Input current, all pins

±10

mA

Output short circuit(2)

Continuous

Continuous

Operating temperature

–55

150

°C

Junction temperature

–55

150

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

Short-circuit to ground, one amplifier per package.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Single-supply

1.7

5.5

V

Dual-supply

±0.85

±2.75

Specified temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

OPA2387

UNIT

DGK (VSSOP)

8 PINS

Junction-to-ambient thermal resistance

165

°C/W

Junction-to-case (top) thermal resistance

53

°C/W

Junction-to-board thermal resistance

87

°C/W

Junction-to-top characterization parameter

4.9

°C/W

Junction-to-board characterization parameter

85

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

OPA2387

SBOS984 – NOVEMBER 2020

www.ti.com

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