DS30482 Rev. 6 - 2

1 of 3

PDS540

PowerDI is a trademark of Diodes Incorporated.

www.diodes.com

PDS540

5A SCHOTTKY BARRIER RECTIFIER

Features

Single phase, half wave, 60Hz, resistive or inductive load.

For capacitive load, derate current by 20%.

·

·

Case Material: Molded Plastic, “Green” Molding

Compound. UL Flammability Classification Rating

94V-0

·

Moisture Sensitivity: Level 1 per J-STD-020C

·

Terminals: Finish – Matte Tin annealed over Copper

leadframe. Solderable per MIL-STD-202, Method

208

·

Polarity: See Diagram

·

Marking: See Page 3

·

Weight: 0.093 grams (approximate)

Mechanical Data

Characteristic

Symbol

Value

Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

40

V

RMS Reverse Voltage

28

V

Average Rectified Output Current (See also figure 5)

5A

Non-Repetitive Peak Forward Surge Current

8.3ms Single half sine-wave Superimposed on Rated Load

120

A

Operating Temperature Range

-55 to +150

°C

Storage Temperature Range

-55 to +150

°C

·

Guard Ring Die Construction for

Transient Protection

·

Low Power Loss, High Efficiency

·

Low Forward Voltage Drop

·

For Use in Low Voltage, High Frequency Inverters,

Free Wheeling, and Polarity Protection Applications

·

High Forward Surge Current Capability

·

Lead Free Finish

·

"Green" Molding Compound (No Br, Sb)

Maximum Ratings

°C unless otherwise specified

E

E1

b1

A

A2

A2

D

b2

b1

e

L1

L1

E

b1

D

b2

b1

e

D2

L

E2

L1

LEFT PIN

RIGHT PIN

Note: Pins Left & Right must

be electrically connected

at the printed circuit board.

BOTTOMSIDE

HEAT SINK

W

Dim

Min

Max

A

1.05

1.15

A2

0.33

0.43

b1

0.80

0.99

b2

1.70

1.88

D

3.90

4.05

D2

3.05 NOM

E

6.40

6.60

e

1.84 NOM

E1

5.30

5.45

E2

3.55 NOM

L

0.75

0.95

L1

0.50

0.65

W

1.20

1.50

All Dimensions in mm

Characteristic

Symbol

Typ

Max

Unit

Thermal Resistance Junction to Soldering Point

¾

4.0

°C/W

Thermal Resistance Junction to Ambient Air (Note 1)

95

¾°C/W

Thermal Resistance Junction to Ambient Air (Note 2)

70

¾°C/W

Thermal Resistance Junction to Ambient Air (Note 3)

50

¾°C/W

Notes:

1. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.

2. Polyimide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.

3. Polyimide PCB, 2 oz. Copper. Cathode pad dimensions 9.4mm x 7.2mm. Anode pad dimensions 2.7mm x 1.6mm.

Thermal Characteristics

°C unless otherwise specified