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LMK04832W/EM Datasheet(PDF) 92 Page - Texas Instruments |
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LMK04832W/EM Datasheet(HTML) 92 Page - Texas Instruments |
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92 / 98 page ![]() Expose copper under the PCB to provide direct copper-to-air interface to dissipate heat. Provide areas of connect copper to allow heat to escape from directly below PCB. Do not let components block all thermal escape from the ground pad. A flexible termination / PCB layout for either CML requiring a pullup to Vcc or LVPECL/LCPECL requiring a pulldown to ground, or the H configuration for any other format as illustrated in layout above. Figure 11-2. Bottom Layer LMK04832-SP SNAS698B – MAY 2020 – REVISED DECEMBER 2020 www.ti.com 92 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: LMK04832-SP |
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