© Koninklijke Philips Electronics N.V. 2005

All rights are reserved. Reproduction in whole or in part is prohibited without the prior

written consent of the copyright owner. The information presented in this document does

not form part of any quotation or contract, is believed to be accurate and reliable and may

be changed without notice. No liability will be accepted by the publisher for any

consequence of its use. Publication thereof does not convey nor imply any license under

patent- or other industrial or intellectual property rights.

Date of release: 2 March 2005

Document number: 9397 750 14586

Published in The Netherlands

Philips Semiconductors

PIP212-12M

DC-to-DC converter powertrain

22. Contents

1

General description . . . . . . . . . . . . . . . . . . . . . . 1

2

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4

Ordering information . . . . . . . . . . . . . . . . . . . . . 2

5

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2

6

Pinning information . . . . . . . . . . . . . . . . . . . . . . 3

6.1

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6.2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

7

Functional description . . . . . . . . . . . . . . . . . . . 4

7.1

Basic operation . . . . . . . . . . . . . . . . . . . . . . . . . 4

7.2

Undervoltage Lockout (UVLO) . . . . . . . . . . . . . 4

7.3

Boost switch . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

7.4

7.5

3-state function . . . . . . . . . . . . . . . . . . . . . . . . . 5

7.6

Automatic Dead-time Reduction (ADR) . . . . . . 5

7.7

Over Temperature Protection (OTP) . . . . . . . . . 6

7.8

Am I Switching (AIS). . . . . . . . . . . . . . . . . . . . . 6

7.9

Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

7.10

Reg5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

8

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7

9

Thermal characteristics. . . . . . . . . . . . . . . . . . . 7

10

Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8

11

Application information. . . . . . . . . . . . . . . . . . 11

11.1

Typical application. . . . . . . . . . . . . . . . . . . . . . 11

11.2

12

Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

13

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14

14

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

14.1

Introduction to soldering surface

mount packages . . . . . . . . . . . . . . . . . . . . . . . 15

14.2

Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 15

14.3

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 15

14.4

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 16

14.5

Package related soldering information . . . . . . 16

15

Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

15.1

PCB design guidelines . . . . . . . . . . . . . . . . . . 17

15.2

Solder paste printing. . . . . . . . . . . . . . . . . . . . 18

16

Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19

17

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 20

18

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

19

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

20

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

21

Contact information . . . . . . . . . . . . . . . . . . . . 20