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LO100 Datasheet(PDF) 3 Page - 3M Electronics |
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LO100 Datasheet(HTML) 3 Page - 3M Electronics |
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3 / 4 page ![]() 3M™ Scotch-Weld™ Low Odor Instant Adhesives LO100 • LO1000 Hot Strength Percent of Initial Strength Temp (F) LO100 LO1000 72 100 100 167 58 56 212 23 23 257 5 10 Handling Information Surface Preparation For optimum strength structural bonds, paint, oxide films, oils, dust, mold release agents, and all other surface contaminants must be completely removed. However, the amount of surface preparation depends on the required bond strength and the environmental aging resistance desired by the user. Typical quick surface preparation would include wiping with a clean solvent (such as isopropyl alcohol*), abrading the surface with a clean fine abrasive, and then wiping again with a clean solvent to remove loose particles. Directions for Use 1. Ensure that parts are clean, dry, and free from oil and grease. 2. An instant adhesive activator may be required if there are bonding gaps or porous substrate surfaces, if substrates are low surface energy plastics (e.g., polyethylene, polypropylene) or if substrates have acidic surfaces (e.g., paper, leather). 3. Bond speed is typically very fast so ensure that parts are properly aligned before dispensing. 4. Product is normally hand applied from the bottle. Apply sparingly to one surface and press parts firmly together until handling strength is achieved. As a general rule, as little cyanoacrylate as possible should be used. Over application will result in slower cure speed and lower bond strength. Cured Bond Characteristics 1. Full bond strength will typically be achieved within a 24 hour cure time. 2. Low humidity or low temperature conditions will slow down the cure rate. 3. After curing, 3M™ Scotch-Weld™ Low Odor Instant Adhesive bonds are suitable for use up to about 160°F (71°C). 4. Cyanoacrylate bond resistance to most oils and solvents is excellent. Long term humidity, moisture, or water immersion may affect the strength of a cured cyanoacrylate bond depending on the substrates and the bond gap. Testing is recommended to evaluate the effect. *Note: When using solvents, extinguish all ignition sources, including pilot lights, and follow the manufacturer’s precautions and directions for use. - 3 - |
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