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847 Datasheet(PDF) 2 Page - 3M Electronics

Part # 847
Description  3M™ Nitrile High Performance Rubber & Gasket Adhesive
PDF  4 Pages
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Manufacturer  3M [3M Electronics]
Direct Link  http://www.3m.com
Logo 3M - 3M Electronics

847 Datasheet(HTML) 2 Page - 3M Electronics

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3M™
Nitrile High Performance Rubber & Gasket Adhesive
847 • 847H
Handling/Application
Information
Directions for Use:
1. Surface Preparation: Remove all dust, dirt, oil, grease, wax, loose paint, etc.
Wiping with a solvent such as methyl ethyl ketone (MEK) or 3M™ Citrus Base
Cleaner will aid in preparing the surface for bonding.*
2. Application Temperature: For best results the temperature of the adhesive and
surfaces to be bonded should be at least 65°F (18°C).
3. Application: Stir well before using
Porous Surface(s): Brush, flow or spray a thin, even coat of adhesive to one or
both surfaces. Coating both surfaces is preferred since it gives greater strength and
permits longer open time before bonding. Very absorbent materials may require
more than one coat. Bond while adhesive is still wet or aggressively tacky. Join
surfaces with firm pressure.
Non-Porous Surfaces: Brush, flow or spray a thin, even coat of adhesive to both
surfaces. Allow adhesive to dry until tacky. Join surfaces with firm pressure.
4. Drying Time: Drying time depends on temperature, humidity, air movement, and
porosity of the materials bonded. Greater immediate strength may be obtained by
heat or solvent reactivation. See Reactivation below.
5. Reactivation: To solvent reactivate, coat both surfaces with adhesive. Allow to
dry tack-free. Lightly wipe one surface with a solvent such as methyl ethyl ketone
(MEK)*
. Complete bond within 30 seconds.
To heat activate, coat both surfaces with adhesive. Allow adhesive to dry
completely. Reactivate by heating one or both surfaces to a minimum of 180°F
(82°C). Assemble immediately (while hot), using firm pressure to ensure contact.
6. Curing: 3M™ Nitrile High Performance Rubber & Gasket Adhesives 847
and 847H may be heat cured to obtain improved physical properties. Cure
assembled parts at time and temperature listed using 100 psi pressure on the
bond line.
Temperature of Bondline
Time for Minimum Cure
200°F (93°C)
120 minutes
240°F (115°C)
40 minutes
280°F (138°C)
12 minutes
320°F (160°C)
8 minutes
360°F (182°C)
5 minutes
400°F (204°C)
2 minutes
7. Cleanup: Excess adhesive may be removed with a solvent such as methyl ethyl
ketone (MEK) or acetone, preferably while adhesive is still wet.*
*When using solvents, extinguish all ignition sources, including pilot lights, and
follow the manufacturer’s precautions and directions for use.
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