UMB05F~UMB10F

Ultra Miniature Glass Passivated Single-Phase

Features

●

Low profile space

●

Ideal for automated placement

●

Glass passivated chip junction

●

Low forward voltage drop

gp

●

Low leakage current

●

High forward surge capability

●

260℃/10 seconds at terminals

SOF2-4

Major Ratings and Characteristics

Mechanical Date

●

Case: SOF2-4 Molded plastic

over glass passivated chip

●

Terminals: Solder plated, solderable per

J-STD-002B and JESD22-B102D

●

Polarity: Polarity symbols marked on body

5.0 μA

1.1 V

150 °C

0.5 A, 0.8 A

50V to 1000V

20 A

●

Polarity: Polarity symbols marked on body

Maximum Ratings & Thermal Characteristics

V

C

V

Maximum RMS voltage

35

70

140

280

420

560

700

UMB

6F

UMB

8F

UMB

10F

UNIT

Maximum repetitive peak reverse voltage

50

100

200

400

Items

Symbol

UMB

05F

UMB

1F

UMB

2F

UMB

4F

600

800

1000

V

150 C

Peak forward surge current 8.3 ms single

half sine-wave superimposed on rated load

(JEDEC Method)

20

A

Maximum average forward rectified current

0.5

0.8

-on glass-epoxy P.C.B

(1)

A

-on aluminum substrate

(2)

Maximum DC blocking voltage

50

100

200

400

600

800

1000

V

Note 1: On glass epoxy P.C.B. mounted on 0.05×0.05″(1.3×1.3mm) pads

Operating junction and storage temperature

range

–55 to +150

℃

Thermal resistance from junction to ambient

per leg

(1)

100

℃

/W

(2)

80

Thermal resistance from junction to lead per

leg

(1)

30

℃

/W

Note 2: On aluminum substrate P.C.B. with an area of 0.8×0.8″(20×20mm) mounted on 0.05×0.05″(1.3×1.3mm) solder pad

Electrical Characteristics

Note 3: Pulse test:300μs pulse width,1% duty cycle.

5

100

μA

Reverse current per leg

--

UNIT

Instantaneous forward voltage per leg

(3)

-

0.96

1.10

V

Items

Test conditions

Symbol

Min

Type

Max

Rev : 01.06.2014

1/3

www.leiditech.com

Rev : 01.06.2014

1/3

www.leiditech.com