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AF3185 Datasheet(PDF) 1 Page - 3M Electronics |
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AF3185 Datasheet(HTML) 1 Page - 3M Electronics |
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1 / 4 page ![]() 3 Scotch-WeldTM Structural Adhesive Film AF 3185 Introduction 3M™ Scotch-Weld™ Structural Adhesive AF 3185 film is a non-volatile, thermosetting epoxy laminating adhesive and glass cloth combination designed for the structural bonding and for the preparation of reinforced epoxy glass laminate. Scotch-Weld AF 3185 film is commonly used for bonding aircraft canopies and windscreens into frames. Scotch-Weld AF 3185 film has been extensively used for bonding printed circuit boards to backing plates in the electronics industry. Advantages • Cure temperatures as low as 200°F (93°C) may be used. • Easy to cut. • Very low flow (< 10%). • Repositionable. • Excellent for vacuum or low pressure curing. • Excellent for bonding glass. Technical Data Issue No. 1 Product Description Form: Style 108 glass cloth preimpregnated with toughened epoxy resin Color: Light Tan Weight: 0.050 ± .01 lb./ft.2 (245 ± 50 g/m2) Caliper: 8 mils Note The technical information and data included in this technical data sheet should be considered representative or typical only and should not be used for specification purposes. |
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