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AF3185 Datasheet(PDF) 1 Page - 3M Electronics

Part # AF3185
Description  Scotch-WeldTM Structural Adhesive Film
PDF  4 Pages
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Manufacturer  3M [3M Electronics]
Direct Link  http://www.3m.com
Logo 3M - 3M Electronics

AF3185 Datasheet(HTML) 1 Page - 3M Electronics

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Scotch-WeldTM
Structural Adhesive Film
AF 3185
Introduction
3M™ Scotch-Weld™ Structural Adhesive AF 3185 film is a non-volatile,
thermosetting epoxy laminating adhesive and glass cloth combination designed for
the structural bonding and for the preparation of reinforced epoxy glass laminate.
Scotch-Weld AF 3185 film is commonly used for bonding aircraft canopies and
windscreens into frames. Scotch-Weld AF 3185 film has been extensively used for
bonding printed circuit boards to backing plates in the electronics industry.
Advantages
• Cure temperatures as low as 200°F (93°C) may be used.
• Easy to cut.
• Very low flow (< 10%).
• Repositionable.
• Excellent for vacuum or low pressure curing.
• Excellent for bonding glass.
Technical Data
Issue No. 1
Product Description
Form:
Style 108 glass cloth preimpregnated
with toughened epoxy resin
Color:
Light Tan
Weight:
0.050 ± .01 lb./ft.2 (245 ± 50 g/m2)
Caliper:
8 mils
Note
The technical information and data included in this technical data sheet should be
considered representative or typical only and should not be used for specification
purposes.


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