KMB22F-KMB210F

Major Ratings and Characteristics

Features

●

Low profile package

●

Ideal for automated placement

●

Ultrafast reverse recovery time

●

Low power losses, high efficiency

●

Low forward voltage drop

●

High surge capability

●

High temperature soldering：

260℃/10 seconds at terminals

●

Component in accordance to

RoHS 2002/95/1 and WEEE 2002/96/EC

Mechanical Date

●

Case:

MBF molded plastic body over

Schottky barrier chips

●

Terminals:

Solder plated, solderable per

J-STD-002B and JESD22-B102D

●

Polarity:

Polarity symbols marked on body

Maximum Ratings & Thermal Characteristics & Electrical Characteristics

Symbol

KMB22F KMB24F KMB26F KMB28F KMB210F

UNIT

20

40

60

80

100

V

14

28

42

56

70

V

20

40

60

80

100

V

A

A

0.50

0.55

0.70

V

mA

pF

℃

/ W

℃

℃

Note：1.Thermal resistance from junction to ambient and from junction to lead P.C.B.mounted on 0.2×0.2"(5.0×5.0mm)copper pad areas.

125 °C

Storage temperature range

Typical Thermal resistance (Note1)

Operating junction temperature range

Peak forward surge current 8.3 ms single half sine-

wave superimposed on rated load

Maximum instantaneous forward voltage at 2.0A

Maximum repetitive peak reverse voltage

85

20

–55 to +125

– 55 to +150

Maximum DC reverse current

at Rated DC blocking voltage

Typical Junction Capacitance at 4.0V,1.0MHz

250

0.5

20

125

50

0.85

Maximum RMS voltage

Maximum DC blocking voltage

Maximum average forward rectified current

0.2×0.2"(5.0×5.0mm)copper pad area

2.0

2.0 A

20 V to 100 V

50 A

0.50 V, 0.55V,0.70 V, 0.85V

Surface Mount Schottky Bridge Rectifiers

http://www.trr-jx.com

version: 02