MX55/57

DS20005972A-page 20

 2018 Microchip Technology Inc.

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Contact Pitch

MILLIMETERS

2.54 BSC

MIN

E

MAX

Contact Pad Length (X6)

Contact Pad Width (X6)

Y

X

1.53

1.60

Microchip Technology Drawing C04-3071A

NOM

6-Lead Low Profile Land Grid Array [APA] - 7x5 mm Body (LLGA)

SILK SCREEN

12

6

C

Contact Pad Spacing

3.93

Contact to Contact (X4)

G1

0.94

Contact to Contact (X3)

G2

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

1.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

E

C

X

Y

G2

G1

2.40