ADF5709

Data Sheet

Rev. A | Page 4 of 9

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

5.5 V dc

−1 V to +25 V

Temperature

Operating

−40°C to +85°C

Storage

−65°C to +150°C

Nominal Junction (to Maintain 1 Million

Hours Mean Time to Failure (MTTF))

135°C

119°C

Peak Reflow (Moisture Sensitivity

Level 3 (MSL3) Rating)

260°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

the thermal resistance from the operating portion of the device

to the outside surface of the package (case) closest to the device

mounting area.

Table 3. Thermal Resistance

Unit

E-24-2

58.6

21.9

°C/W

using 2S2P on FR4 with four standard JEDEC vias (0.3 mm diameter,

0.025 mm plating, and 1.2 mm pitch).

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of

ESD-sensitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

ESD Ratings for ADF5709

Table 4. ADF5709, 24-Terminal Ceramic LCC

ESD Model

Withstand Threshold (V)

Class

250

1A

ESD CAUTION