a

t

a

D

l

a

c

i

n

a

h

c

e

M

s

e

r

u

t

a

e

F

s

c

i

t

s

i

r

e

t

c

a

r

a

h

C

l

a

c

i

r

t

c

e

l

E

d

n

a

s

g

n

i

t

a

R

m

u

m

i

x

a

M

Ideal for printed circuit board

Glass passivated chip junctions

High surge overload rating: 60A peak

High case dielectric strength

Solder DIP 260℃ , 40 seconds

Case: KBPM

Terminals: Silver plated (E4 Suffix) Leads, solderable per

J-STD-002B and JESD22-B102D

Polarity : As marked on body

Miniature Glass Passivated Single-Phase Bridge Rectifiers

Reverse Voltage 50 to 1000 Volta , Forward Current 2.0 Ampere

SEMICONDUCTOR

TECHNICAL DATA

KBP2005 ~ KBP210

2011 11 28

1/2

Revision No : 0

Epoxy meets UL-94V-0 Flammability rating

Parameter

Symbol

s

KBP2

005

KBP2

01

KBP2

02

KBP2

04

KBP2

06

KBP2

08

KBP2

10

Units

Maximum repetitive peak reverse voltage

50

100

200

400

600

800

1000

Volts

V

e

g

a

t

l

o

v

S

M

R

m

u

m

i

x

a

M

RMS

35

70

140

280

420

560

800

Vlots

Maximum DC blocking voltage

50

100

200

400

600

800

1000

Volts

Maximum

average

forward

rectified

output

2.0

Amps

Peak forward surge current,8.3ms single half

sine-wave superimposed on rated load(JEDEC

Method)

60

Amps

I

)

s

m

3

.

8

<

t

(

g

n

i

s

u

f

r

o

f

g

n

i

t

a

R

15

A

C

Max. instantaneous forward voltage drop per

element (Test conditions 2 A)

1.1

Volts

at rated DC blocking voltage per element

5.0

100

uA

Typical junction capacitance per element at 4.0V,

1MHZ

25

pF

Typical thermal resistance per leg(Note 1)

30

11

Operating

junction

and storage

temperature

range

-55

to

+150

Notes: 1. Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with

0.47’’X0.47’’ (12X12 mm) copper pads

* JEDEC registered values