Features

● Glass passivated chip

● 200 W peak pulse power capability with a 10/1000

us waveform, repetitive rate (duty cycle):0.01 %

● Excellent clamping capability

SOD123FL

Excellent clamping capability

● Low reverse leakage

● Very fast response time

● Lead and body according with RoHS standard

Mechanical Data

C

SOD123FL M ld d l ti

● Case: SOD123FL Molded plastic

● Lead: Solderable per MIL-STD-750, method 2026

● Epoxy: UL 94V-0 rate flame retardant

● Polarity: Color band denotes cathode end except Bipolar

● Mounting position: Any

Unit: inch (mm)

Maximum Ratings & Characteristics Ratings at 25℃ ambient temperature unless otherwise specified.

Unit

W

A

27.5

Parameter

Symbols

Value

200

W

A

V

℃

Note:

Operating junction and storage temperature range

-55 to +150

Peak forward surge current, 8.3 ms single half sinewave

30

Maximum instantaneous forward voltage at 10 A for

unidirectional only

3.5

Power dissipation on infinite heatsink at TL = 75 °C

1.0

Note:

1)Non-repetitive current pulse per Fig.5 and derated above TA= 25 °C per Fig.1；

2)Measured on 8.3 ms single half sine-wave or equivalent square wave, duty cycle = 4 pulses per minute maximum；

MMF3.3A/CA

Rev :

www.leiditech.com

01.06.2018

1/3