PRT2011DAF4A datasheet(1/112 Pages) NXP

Part #	PRT2011DAF4A

Description	i.MX RT1064 Crossover Processors Data Sheet for Consumer Products

PDF	112 Pages

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Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

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NXP Semiconductors

Data Sheet: Technical Data

Document Number: IMXRT1064CEC

Rev. 2, 08/2020

MIMXRT1064DVL6A

MIMXRT1064DVL6B

MIMXRT1064DVJ6A

MIMXRT1064DVJ6B

Package Information

Plastic Package

196-pin MAPBGA, 10 x 10 mm, 0.65 mm pitch

196-pin MAPBGA, 12 x 12 mm, 0.8 mm pitch

Ordering Information

See Table 1 on page 6

NXP reserves the right to change the production detail specifications as may be required

to permit improvements in the design of its products.

1

i.MX RT1064 Introduction

The i.MX RT1064 is a new processor family featuring

NXP’s advanced implementation of the Arm

Cortex®-M7 core, which operates at speeds up to 600

MHz to provide high CPU performance and best

real-time response.

The i.MX RT1064 processor has 4 MB on chip Flash and

1 MB on-chip RAM. 512 KB SRAM can be flexibly

configured as TCM or general-purpose on-chip RAM,

while the other 512 KB SRAM is general-purpose

on-chip RAM. The i.MX RT1064 integrates advanced

power management module with DCDC and LDO that

reduces complexity of external power supply and

simplifies power sequencing. The i.MX RT1064 also

provides various memory interfaces, including SDRAM,

RAW NAND FLASH, NOR FLASH, SD/eMMC, Quad

SPI, and a wide range of other interfaces for connecting

peripherals, such as WLAN, Bluetooth™, GPS,

displays, and camera sensors. The i.MX RT1064 has rich

audio and video features, including LCD display, basic

2D graphics, camera interface, SPDIF, and I2S audio

i.MX RT1064 Crossover

Processors Data Sheet

for Consumer Products

1. i.MX RT1064 Introduction . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 6

2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.1. Special signal considerations . . . . . . . . . . . . . . . 16

3.2. Recommended connections for unused analog

interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 19

4.1. Chip-Level conditions . . . . . . . . . . . . . . . . . . . . . 19

4.2. System power and clocks . . . . . . . . . . . . . . . . . . 26

4.3. I/O parameters . . . . . . . . . . . . . . . . . . . . . . . . . . 31

4.4. System modules . . . . . . . . . . . . . . . . . . . . . . . . . 38

4.5. External memory interface . . . . . . . . . . . . . . . . . 43

4.6. Display and graphics . . . . . . . . . . . . . . . . . . . . . . 53

4.7. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

4.8. Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

4.9. Communication interfaces . . . . . . . . . . . . . . . . . . 66

4.10. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

5. Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

6. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 82

6.1. Boot mode configuration pins . . . . . . . . . . . . . . . 82

6.2. Boot device interface allocation . . . . . . . . . . . . . . 82

7. Package information and contact assignments . . . . . . . 87

7.1. 10 x 10 mm package information . . . . . . . . . . . . 87

7.2. 12 x 12 mm package information . . . . . . . . . . . . 99

8. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111

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