LDT4032 datasheet(4/7 Pages) LEIDITECH

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- Reflow soldering

TS(min)

TS(max)

time to peak temperatue

Time

(t 25

℃ to peak)

Ramp-up

Ramp-down

Preheat

Critical Zone

TL to TP

Profile feature

Sn-Pb assembly

Pb-Free assembly

Average ramp-up rate (TSmax to Tp)

3℃/sec. Max

Preheat

-Temperature min. (Ts(min)) +100℃

+150℃

-Temperature max.(Ts(max)) +150℃

+200℃

-Time (tSmin to tSmax)

60-120 secs.

60-180 secs.

Ts(max) to TL - Ramp-up Rate

3℃/sec. Max

Time maintained

above

-Temperature min. (TL)

+183℃

+217℃

-Time (tL)

60-150 secs.

Peak classification temperature (Tp)

+220℃ to +240℃

+240℃ to +260℃

Time within 5℃of actual peak temperature (tp) 10 secs. to 30 secs.

20 secs. to 40 secs.

Ramp-down rate

6℃/sec. max.

Time 25℃ to peak temperature

6 min. max.

8 min. max.

Notes: All temperature refer to topside of the package, measured on the package body surface

Maximum number of reflow cycles: 3

STORAGE CONDITION

- As far as possible, the components should be employed within 24 months after delivery

from Kangtai Semiconductor.

- They should be left in their original packing to avoid soldering problems due to oxidized

contacts.

- Storage temperature: − 25 up to + 45°C.

- Relative humidity: < 75 % annual average, < 95 % on max. 30 days in a year.

LDT4032 Series

Rev 2.0 :

www.leiditech.com

12.01.2019

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