PRT2011DAF4A datasheet(48/113 Pages) NXP

48 / 113 page

i.MX RT1064 Crossover Processors for Industrial Products, Rev. 2, 08/2020

NXP Semiconductors

Electrical Characteristics

Figure 18. SEMC input timing in SYNC mode

4.5.2

FlexSPI parameters

Measurements are with a load 15 pf and input slew rate of 1 V/ns.

4.5.2.1

FlexSPI input/read timing

There are four sources for the internal sample clock for FlexSPI read data:

•

Dummy read strobe generated by FlexSPI controller and looped back internally

(FlexSPIn_MCR0[RXCLKSRC] = 0x0)

•

Dummy read strobe generated by FlexSPI controller and looped back through the

DQS pad (FlexSPIn_MCR0[RXCLKSRC] = 0x1)

•

Read strobe provided by memory device and input from DQS pad

(FlexSPIn_MCR0[RXCLKSRC] = 0x3)

The following sections describe input signal timing for each of these four internal sample clock sources.

4.5.2.1.1

SDR mode with FlexSPIn_MCR0[RXCLKSRC] = 0x0, 0x1

Table 37. FlexSPI input timing in SDR mode where FlexSPIn_MCR0[RXCLKSRC] = 0X0

Symbol

Parameter

Min

Max

Unit

Frequency of operation

—

MHz

TIS

Setup time for incoming data

8.67

—

TIH

Hold time for incoming data

—

Table 38. FlexSPI input timing in SDR mode where FlexSPIn_MCR0[RXCLKSRC] = 0X1

Symbol

Parameter

Min

Max

Unit

Frequency of operation

—

133

MHz

TIS

Setup time for incoming data

—

TIH

Hold time for incoming data

—

PRT2011DAF4A Datasheet(PDF) 48 Page - NXP Semiconductors

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