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MCH313FN106ZP Datasheet(PDF) 4 Page - Rohm

Part # MCH313FN106ZP
Description  Multi-layer ceramic chip capacitors
PDF  11 Pages
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Manufacturer  ROHM [Rohm]
Direct Link  http://www.rohm.com
Logo ROHM - Rohm

MCH313FN106ZP Datasheet(HTML) 4 Page - Rohm

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MCH31
Ceramic capacitors
4/10
Resistance
to soldering
heat
As per 4.14 of
JIS C 5101-1.
As per 4.10 of
JIS C 5101-10
The solder specified in JIS Z 3282. H63A
shall be used.
The specimens shall be immersed into the
solder at 260
+/−5°C for 5+/−0.5s so that
both end terminations are completely
under the solder.
Pre-heating at 150
+/−10°C for 1 to 2min
Initial measurements prior to test shall be
performed after the thermal
Pre-conditioning specified in Remarks (1).
Final measurements shall be made after the
specimens have been left at room
temperature as per Table3.
As per 4.13 of JIS C 5101-1.
As per 4.8 ofJIS C 5101-10
A 5N weight for
10
+/−1s shall be applied
to the soldered specimens as shown by the
arrow mark in the below sketch.
8
End termination
adherence
9
A, A N
C N
F N
Within
+/−2.5%
Within
+/−7.5%
Within
+/−20%
Appearance
Dielectric
loss
tangent
Within specified initial value.
Insulation
resistance
Within specified initial value.
Withstanding
voltage
No defects shall be allowed.
Without peeling or sign of
peeling shall be allowed
on the end terminations.
Change
rate from
initial value
Without mechanical damage.
Table3
24
+/−2 h
48
+/−4 h
Charac-
teristic
Time
A, AN
CN, FN
Applied pressure
Capacitor
Substrate
Items
Performance
Test Method
(As per JIS C 5101-1, JIS C 5101-10)
As per 4.24 of JIS C 5101-1.
As per 4.7 of JIS C 5101-10
Temperature coefficient shall be calculated
at 20
°C and 85°C.
As per 4.24 of JIS C 5101-1.
As per 4.7 of JIS C 5101-10
If required, measurements shall be made
at a given temperature.
As per 4.15.2 of JIS C 5101-1.
As per 4.11 of JIS C 5101-10
The solder specified in JIS Z 3282 H63A
shall be used. Ans the flux containing 25%
rosin and ethanol solution shall be used.
The specimens shall be immersed into the
solder at 235
+/−5°C for 2+/−0.5s
So that both end terminations are
completely under solder.
No.
Temperature
characteristic
More than 3/4 of each end
termination shall be covered with
new solder.
6
Solderability
7
A, A N
C N
F N
0
+/−30ppm / °C
(
−55°C to +125°C)
+30%, −80%
(
−25°C to +85°C)
+22%, −82%
(
−30°C to +85°C)
+/−10%
(
−25°C to +85°C)
+/−15%
(
−55°C to +85°C)
X5R
B
+/−15%
(
−55°C to +125°C)
X7R
R



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