LP1101SB datasheet(3/4 Pages) LEIDITECH

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SOLDERING PARAMETERS

Reflow Condition

Pb-Free assembly

(see FIG.2)

Pre Heat

-Temperature Min (Ts(min))

+150℃

-Temperature Max(Ts(max))

+200℃

-Time (Min to Max) (ts)

60-180 secs.

Average ramp up rate (Liquid us Temp (TL) to peak)

3℃/sec. Max

Ts(max) to TL - Ramp-up Rate

3℃/sec. Max

Reflow

-Temperature(TL) (Liquid us)

+217℃

-Temperature(tL)

60-150 secs.

Peak Temp (Tp)

+260(+0/-5)℃

Time within 5℃ of actual Peak Temp (tp)

30 secs. Max

Ramp-down Rate

6℃/sec. Max

Time 25℃ to Peak Temp (TP)

8 min. Max

Do not exceed

+260℃

FIG.1: tr × td pulse waveform

%IPP

100

t(μs)

Peak value

tr = rise time to peak value

td = decay time to half value

Half value

FIG.2: Reflow condition

TS(min)

TS(max)

time to peak temperatue

Time

(t 25

to peak)

℃

Ramp-up

Ramp-down

Preheat

Critical Zone

TL to TP

FIG.3: Normalized Vs change vs. junction

temperature

FIG.4: Normalized DC holding current vs. case

temperature

IH(Tj)/IH(Tj=25

)

℃

0.4

-40 -20

100 120 140 160

Tj(

)

℃

-8

Percent of Vs change(%)

2.0

1.2

TC (

)

℃

-4

-40 -20

100 120 140 160

0.8

1.6

0.6

1.0

1.4

1.8

25℃

Rev.O 1/4

Rev : 01.06.2014

3/4

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LP1101SB

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